PHIX Photonics Assembly
PHIX turns bare quantum photonic chips into modules that can connect to an experimental or commercial system. Its offering covers prototype packages, scalable manufacturing and contract assembly.
Netherlands · Research reviewed 11 Sept 2026Initial record: initial assessment recorded.
Review history 1 record
Record dates show when an assessment or clarification was saved. Review dates show the evidence check. Earlier records were recovered from QubitWire’s source history; no earlier score movement is inferred.
Initial assessment recorded
Assessment reviewed 11 Sept 2026 · Research reviewed 11 Sept 2026Sources in this record (3)
What it does. Where it fits.
Hybrid assembly and packaging around photonic integrated circuits, connecting optical fibres, electronics and thermal management.
Who should look closer
Photonic quantum companies moving a bare chip into a packaged, connected module.
QubitWire’s editorial assessment of practical fit.Prototype, volume and contract packaging
Customers can request package engineering, module production or manufacturing capacity through the quantum market page.
Check the current access route ↗What has been demonstrated
The QuiX case describes a working module with fibre and electrical coupling and cooling. Separate projects aim to extend connection density.
What remains unresolved
Historical module examples do not establish current maximum mode counts. Qmode and QuScale targets describe development work, and packaging alone does not prove quantum computational advantage.
The next question to watch
Report repeatable optical coupling loss, thermal stability and assembly yield at higher processor densities.
A research question, not a promised milestone.QubitWire coverage
No published QubitWire stories currently match this organization. The evidence sources below provide the starting point.
Sources & evidence
- PHIX quantum packaging and QuiX case ↗Organization-originated source · Publication date not stated
PHIX describes packaging a QuiX 12×12-mode processor with two fibre arrays, ribbon-cable wire bonds and a thermoelectric cooler, plus prototype and volume manufacturing services.
- PHIX Qmode project ↗Organization-originated source · Publication date not stated
Defines development of packaging for 50 input/output modes, over 100 optical connections and up to 5,000 electrical connections; these are project objectives.
- QuiX QuScale project ↗Organization-originated source · Publication date not stated
The processor company identifies PHIX as a collaborator in scalable electrical interconnection and chip packaging.
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