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COMPANY RESEARCH · Enabling technology

PHIX Photonics Assembly

PHIX turns bare quantum photonic chips into modules that can connect to an experimental or commercial system. Its offering covers prototype packages, scalable manufacturing and contract assembly.

Official website ↗
Netherlands · Research reviewed 11 Sept 2026

Initial record: initial assessment recorded.

Review history 1 record

Record dates use UTC and show when an assessment or clarification was saved. Review dates show the evidence check. Earlier records were recovered from QubitWire’s source history; no earlier score movement is inferred.

  1. Initial assessment recorded

    Assessment reviewed 11 Sept 2026 · Research reviewed 11 Sept 2026

    Open this evidence record →

    Sources in this record (3)
Identity & attribution
Organization record
PHIX Photonics Assembly (organization-phix-photonics-assembly)
Recorded role
Photonic quantum-chip packaging, fibre-array attachment, electrical interconnect assembly and scalable module manufacturing
Recorded aliases
No aliases recorded in this assessment.
Name and period
No dated name or ownership transition is recorded here. An alias is a search aid, not evidence of a legal ownership relationship.
Product scope
Hybrid assembly and packaging around photonic integrated circuits, connecting optical fibres, electronics and thermal management.

A company profile may discuss several systems. Capabilities remain attached to the product and conditions named in each source; they do not transfer automatically to related organizations. A verified security relationship has not been attached to this record.

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TECHNOLOGY & ACCESS

What it does. Where it fits.

Hybrid assembly and packaging around photonic integrated circuits, connecting optical fibres, electronics and thermal management.

Who should look closer

Photonic quantum companies moving a bare chip into a packaged, connected module.

QubitWire’s editorial assessment of practical fit.

Prototype, volume and contract packaging

Customers can request package engineering, module production or manufacturing capacity through the quantum market page.

Check the current access route ↗
DOCUMENTED EVIDENCE

What the sources establish

The QuiX case describes a working module with fibre and electrical coupling and cooling. Separate projects aim to extend connection density.

phix.com ↗phix.com ↗quixquantum.com ↗

What remains unresolved

Historical module examples do not establish current maximum mode counts. Qmode and QuScale targets describe development work, and packaging alone does not prove quantum computational advantage.

The next question to watch

Report repeatable optical coupling loss, thermal stability and assembly yield at higher processor densities.

A research question, not a promised milestone.

QubitWire coverage

No published QubitWire stories currently match this organization. The evidence sources below provide the starting point.

Open research questions

Editorial questions for this profile. No reviewed closure decision has been recorded; unanswered questions do not lower the official score.

Open research question

Report repeatable optical coupling loss, thermal stability and assembly yield at higher processor densities.

What evidence would help

A source addressing this question must identify the named system, experiment or deployment, its conditions, measured outcome and remaining limitations. Are performance limits stated under realistic loads and operating conditions?

What would resolve it?

An editorial review must explain which part of this question the evidence resolves. A roadmap or an announcement alone does not close it.

No resolved, partial or disputed outcome is asserted without a reviewed transition and its evidence.

Suggest evidence
Open research question

Which named system or service can I use under the documented access route?

What evidence would help

Check the current terms for prototype, volume and contract packaging. Identify the system version, eligibility, restrictions and whether the result used hardware or simulation.

What would resolve it?

Current primary documentation must identify the offering, eligible user and access conditions. An unspecified company-level access claim is insufficient.

No resolved, partial or disputed outcome is asserted without a reviewed transition and its evidence.

Suggest evidence
Open research question

Are the interfaces compatible with your existing hardware?

What evidence would help

Provide the source location, relevant product or generation, workload, resource constraints and reported uncertainty. Keep measurements, simulations and announced targets distinct.

What would resolve it?

A source reviewer must map the evidence to this exact scope. Missing disclosure remains unknown; it is not technical failure.

No resolved, partial or disputed outcome is asserted without a reviewed transition and its evidence.

Suggest evidence

Questions are drawn from the existing brief and sector reading guide. Research brief reviewed 11 Sept 2026. Following stores a local bookmark; it does not send email alerts or imply a scheduled review.

Since your review

Scope: PHIX Photonics Assembly. Reading a page never marks its records reviewed.

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Existing material records remain available after setup. Routine rechecks and initial entries are excluded from material counts.

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From claim to assessment

These are the existing assessment claims and their recorded criterion links. A source link is not an independent replication. New research does not change these published ratings automatically.

Source references in method 1.0 · assessment reviewed 11 Sept 2026
Recorded claim & sourceAssessment linkageProvenance & limits
Source 1

PHIX describes packaging a QuiX 12×12-mode processor with two fibre arrays, ribbon-cable wire bonds and a thermoelectric cooler, plus prototype and volume manufacturing services.

PHIX quantum packaging and QuiX case ↗Published Not recorded
Exact source location

No page, figure or section locator is recorded. Open the source and check the claim in its original context.

Capability

The documented customer module combines optical coupling, electrical bonding and cooling in a commercial quantum-photonic processor.

Delivery

Prototype packaging, volume packaging and contract manufacturing have defined access routes.

Use in practice

A named customer’s commercial processor uses PHIX packaging; the account is supplier-written rather than an independent acceptance report.

Integration

The case details working optical, ribbon-cable and thermoelectric interfaces, and QuiX confirms continuing packaging collaboration.

Published rating inputs remain unchanged.		Organization-originated source

Source type: Vendor customer case study. Independent replication, experiment date and source-version fingerprint are not separately recorded.

Product and measurement scope: read the named system and conditions in this claim. No normalized product revision is assigned.

Review recorded 11 Sept 2026. Research brief reviewed 11 Sept 2026. These dates do not establish publication or experiment dates.

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Source 2

Defines development of packaging for 50 input/output modes, over 100 optical connections and up to 5,000 electrical connections; these are project objectives.

PHIX Qmode project ↗Published Not recorded
Exact source location

No page, figure or section locator is recorded. Open the source and check the claim in its original context.

Published rating inputs remain unchanged.Organization-originated source

Source type: Vendor project report. Independent replication, experiment date and source-version fingerprint are not separately recorded.

Product and measurement scope: read the named system and conditions in this claim. No normalized product revision is assigned.

Review recorded 11 Sept 2026. Research brief reviewed 11 Sept 2026. These dates do not establish publication or experiment dates.

Report an issue with this claim →
Source 3

The processor company identifies PHIX as a collaborator in scalable electrical interconnection and chip packaging.

QuiX QuScale project ↗Published Not recorded
Exact source location

No page, figure or section locator is recorded. Open the source and check the claim in its original context.

Integration

The case details working optical, ribbon-cable and thermoelectric interfaces, and QuiX confirms continuing packaging collaboration.

Published rating inputs remain unchanged.		Organization-originated source

Source type: Customer project report. Independent replication, experiment date and source-version fingerprint are not separately recorded.

Product and measurement scope: read the named system and conditions in this claim. No normalized product revision is assigned.

Review recorded 11 Sept 2026. Research brief reviewed 11 Sept 2026. These dates do not establish publication or experiment dates.

Report an issue with this claim →
Revision and evidence-family boundaries

Record reference: a1287674ed4510023729b9df836e48cbcd44c67e59ca6954fc9c6c037d4877c8. Read prior recorded revisions.

Repeated coverage can describe the same experiment. The assessment does not contain a reviewed claim-family grouping, so the number of links is never shown as a replication count. Source pages can change independently of this saved assessment; the original source text is not archived here.

CHECK THE ORIGINALS

Sources & evidence

  1. PHIX quantum packaging and QuiX case ↗Organization-originated source · Publication date not stated

    PHIX describes packaging a QuiX 12×12-mode processor with two fibre arrays, ribbon-cable wire bonds and a thermoelectric cooler, plus prototype and volume manufacturing services.

  2. PHIX Qmode project ↗Organization-originated source · Publication date not stated

    Defines development of packaging for 50 input/output modes, over 100 optical connections and up to 5,000 electrical connections; these are project objectives.

  3. QuiX QuScale project ↗Organization-originated source · Publication date not stated

    The processor company identifies PHIX as a collaborator in scalable electrical interconnection and chip packaging.

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