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A small patterned chip sits in a gold-colored square package on a metal work surface beside two metal tools.
OJB Quantum — 24 Transmon Qubits Patterned by Direct Write LASER Lithography 003.jpg — CC BY 4.0 — https://commons.wikimedia.org/wiki/File:24_Transmon_Qubits_Patterned_by_Direct_Write_LASER_Lithography_003.jpg — https://creativecommons.org/licenses/by/4.0.
Processors · Superconducting

The package around a transmon chip

A package creates a practical boundary between a delicate chip and the equipment that will operate it. Here the source describes a patterned chip resting on a package used with wire bonding. The surrounding metal and tools give a stronger sense of scale than an isolated product image. Do not describe visible positioning as completed electrical assembly: this photograph does not establish which connections have been made or tested. Use it to explain the questions a package must answer, including how the chip is supported, how signals reach it and how the completed assembly will be inspected.

Organization
OJB Quantum
Image type
Photograph
Capture date
2026-08-02
Photographer / creator
OJB Quantum
Reuse terms
CC BY 4.0

OJB Quantum — 24 Transmon Qubits Patterned by Direct Write LASER Lithography 003.jpg — CC BY 4.0 — https://commons.wikimedia.org/wiki/File:24_Transmon_Qubits_Patterned_by_Direct_Write_LASER_Lithography_003.jpg — https://creativecommons.org/licenses/by/4.0.

Full original frame retained; EXIF orientation normalized where present, resized without enlargement and converted to WebP. No crop or content alteration.

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The package begins the connection to the rest of the experiment

The package view changes the scale of the story. A small patterned chip now sits inside a larger gold-colored support, with a work surface and tools nearby. The photograph gives a reader a place to ask how an experimental chip will be held, connected and handled.

Packaging creates interfaces between a device and its surroundings. In a quantum experiment, those interfaces must support the intended signals and environment while avoiding unwanted interactions. The photograph identifies a physical arrangement, but it does not reveal the function of every connection or show that the assembly is ready for operation.

Use this image after the patterned-surface view. The sequence explains a progression from fabrication to integration without pretending that the two photographs contain the entire manufacturing record. A later cold-test photograph or a linked measurement report would supply a different stage of the evidence.

What changes between the two views?

The surrounding package and handling context become visible. The new information concerns integration and scale, not an automatically improved qubit specification.

Can the metal color establish the material?

No. Appearance alone is insufficient for a material identification; use the source’s verified fabrication documentation for that claim.

Why avoid naming every visible connection?

A photograph may not reveal its electrical or thermal purpose. Incorrect labels can turn a useful image into a misleading engineering diagram.

An independent QubitWire lesson based on this image and the cited source reading. The image does not establish a performance result.

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Where a patterned chip becomes an experimental device →

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More from the same organization or hardware architecture.

A dark square chip with four repeated patterned areas and iridescent gold and blue reflections.A patterned transmon chip before packagingSame organization · OJB QuantumOJB Quantum · CC BY 4.0An exposed Quantum System One assembly at IBM’s Thomas J. Watson Research Center in Yorktown Heights, New York.Quantum System One at ThinkLabSame architecture · SuperconductingOnri Jay Benally (OJB Quantum) · CC BY 4.0An open copper-colored processor package held beneath laboratory equipment, with a small chip at its center.Inside an AQT processor packageSame architecture · SuperconductingAdvanced Quantum Testbed/Berkeley Lab · NQI gallery reuse permissionAn exposed gold-colored dilution refrigerator hangs in a blue-lit frame with many wires descending through its stages.Inside the SQMS Quantum GarageSame architecture · SuperconductingRyan Postel / Fermilab · NQI gallery reuse permissionA processor with three qubits and three readout cavities, fabricated at Chalmers’ Nanofabrication Laboratory in 2017.Three qubits in the palm of a handSame architecture · SuperconductingAnita Fors (Chalmers) · CC BY-SA 4.0Google’s Sycamore quantum chip on display at the Deutsches Museum in Munich. This photograph shows a museum exhibit.Sycamore on displaySame architecture · SuperconductingColdupnorth · CC BY-SA 4.0

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